Thermal Interface Materials

Function

Thermal interface materials (TIMs) are substances applied between two components to enhance heat transfer, typically between a heat-generating chip and a heat sink or cooling solution. Their primary function is to fill microscopic air gaps, which are poor thermal conductors, thereby reducing thermal resistance. Common TIMs include thermal pastes, pads, and liquid metals. These materials are critical for efficient heat dissipation in high-performance computing. They ensure optimal operating temperatures for ASICs.